NXP Semiconductors MPC8309CVMAHFCA
$ 25.72
Obsolete
Prix et stock
Distributeurs agréés
Distributeurs de solutions de stockage non agréés
Revendeurs non agréés
Modèles CAO
Télécharger le symbole, l’empreinte et le 3D STEP
Pièces de rechange
0 composant disponible
Fiches techniques et documents
Téléchargez les fiches techniques et la documentation du fabricant pour NXP Semiconductors MPC8309CVMAHFCA.
Chaîne d'approvisionnement
Country of OriginMainland China
Export Control Classification Number (ECCN) Code3A991.A.2
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2011-08-18
Lifecycle StatusObsolete (Last Updated: 5 months ago)
LTB Date2023-03-30
LTD Date2024-06-30
Pièces détachées
NXP SemiconductorsMPC8309VMAFDCA
MPU PowerQUICC II Pro MPC83xx Processor RISC 32bit 0.09um 333MHz 1.8V/3.3V 489-Pin MAP-BGA Tray
NXP SemiconductorsMPC8306CVMAFDCA
Microprocessor PowerQUICC II Pro MPC83xx RISC 32-Bit 0.09um 333MHz 369-Pin MAP-BGA Tray
NXP SemiconductorsMPC8313VRAFFC
MPU MPC83xx RISC 32-Bit 0.09um 333MHz 1V/1.8V/2.5V/3.3V 516-Pin TEBGA
Descriptions
Descriptions de NXP Semiconductors MPC8309CVMAHFCA fournies par ses distributeurs.
MPU PowerQUICC II Pro MPC83xx Processor RISC 32bit 0.09um 417MHz 1.8V/3.3V 489-Pin MAP-BGA Tray
Powerquicc, Power Arch Soc, 417Mhz, Ddr2 W/ecc, Pci, Hdlc, Tdm, Enet, Usb, Can, -40 To 105C, Rev 1.1 Rohs Compliant: Yes
MCU, 32BIT, POWER, 417MHZ, MAPBGA-489; Product Range: PowerQUICC Family PowerQUICC II Pro Series Microprocessors; MPU Core Size: 32bit; Program Memory Size: -; No. of Pins: 489Pins; MPU ; Available until stocks are exhausted
MPU Core = e300 / Data Bus Width Bit = 32 / Family Name = PowerQUICC / Cores = 1 / Clock Frequency Max. MHz = 417 / Interfaces = USB / Interfaces = Ethernet / Interfaces = I²C / Interfaces = SPI / Interfaces = UART / Interfaces = PCI / Interfaces = SDHC / Interfaces = TDM / L1 Cache Instruction Memory kB = 16 / L1 Cache Data Memory kB = 16 / Number of Timers/Counters = 10 / I/O Voltage V = 3.3 / Supply Voltage Min. mV = 950 / Supply Voltage Max. V = 1.05 / Operating Temperature Min. °C = -40 / Operating Temperature Max. °C = 105 / Package Type = LFBGA / Pins = 489 / Mounting Type = SMD / MSL = Level-3 / Packaging = Tray / Length mm = 19 / Width mm = 19 / Height mm = 1.61 / Reflow Temperature Max. °C = 260
Alias du fabricant
NXP Semiconductors possède plusieurs marques à travers le monde que les distributeurs peuvent utiliser comme noms alternatifs. NXP Semiconductors peut également être connu sous les noms suivants :
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Modèles CAO
Télécharger le symbole, l’empreinte et le 3D STEP
Pièces de rechange
0 composant disponible
Spécifications techniques
Physical
Case/PackageLFBGA
MountSurface Mount
Number of Pins489
Number of Terminals489
Weight1.035211 g
Technical
Data Bus Width32 b
Frequency417 MHz
Interface2-Wire, I2C, PCI, SPI
Max Frequency66.67 MHz
Max Operating Temperature105 °C
Max Supply Voltage1.05 V
Min Operating Temperature-40 °C
Min Supply Voltage950 mV
Nominal Supply Voltage (DC)1 V
Number of Cores1
Number of I/Os56
Number of Programmable I/O56
Number of Timers/Counters3
RAM Size48 kB
Schedule B8542310000
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)1.61 mm
Length19 mm
Terminal Pitch800 µm
Width19 mm
Fiches techniques et documents
Téléchargez les fiches techniques et la documentation du fabricant pour NXP Semiconductors MPC8309CVMAHFCA.
Conformité
Classification environnementale
Radiation HardeningNo
REACH SVHCYes
RoHSCompliant
Déclarations de conformité