NXP Semiconductors MPC8309CVMAHFCA
$ 25.72
Obsolete
Preis und Lagerbestand
Autorisierte Distributoren
Nicht-autorisierte lagerhaltende Distributoren
Nicht autorisierte Händler
Datenblätter und Dokumente
Laden Sie Datenblätter und Herstellerdokumentation für NXP Semiconductors MPC8309CVMAHFCA herunter.
Lieferkette
Country of OriginMainland China
Export Control Classification Number (ECCN) Code3A991.A.2
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2011-08-18
Lifecycle StatusObsolete (Last Updated: 5 months ago)
LTB Date2023-03-30
LTD Date2024-06-30
Verwandte Teile
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Beschreibungen
Beschreibungen von NXP Semiconductors MPC8309CVMAHFCA, die von den Distributoren bereitgestellt werden.
MPU PowerQUICC II Pro MPC83xx Processor RISC 32bit 0.09um 417MHz 1.8V/3.3V 489-Pin MAP-BGA Tray
Powerquicc, Power Arch Soc, 417Mhz, Ddr2 W/ecc, Pci, Hdlc, Tdm, Enet, Usb, Can, -40 To 105C, Rev 1.1 Rohs Compliant: Yes
MCU, 32BIT, POWER, 417MHZ, MAPBGA-489; Product Range: PowerQUICC Family PowerQUICC II Pro Series Microprocessors; MPU Core Size: 32bit; Program Memory Size: -; No. of Pins: 489Pins; MPU ; Available until stocks are exhausted
MPU Core = e300 / Data Bus Width Bit = 32 / Family Name = PowerQUICC / Cores = 1 / Clock Frequency Max. MHz = 417 / Interfaces = USB / Interfaces = Ethernet / Interfaces = I²C / Interfaces = SPI / Interfaces = UART / Interfaces = PCI / Interfaces = SDHC / Interfaces = TDM / L1 Cache Instruction Memory kB = 16 / L1 Cache Data Memory kB = 16 / Number of Timers/Counters = 10 / I/O Voltage V = 3.3 / Supply Voltage Min. mV = 950 / Supply Voltage Max. V = 1.05 / Operating Temperature Min. °C = -40 / Operating Temperature Max. °C = 105 / Package Type = LFBGA / Pins = 489 / Mounting Type = SMD / MSL = Level-3 / Packaging = Tray / Length mm = 19 / Width mm = 19 / Height mm = 1.61 / Reflow Temperature Max. °C = 260
Aliasnamen des Herstellers
NXP Semiconductors verfügt über mehrere Marken auf der ganzen Welt, die von Händlern als alternative Namen verwendet werden können. NXP Semiconductors ist möglicherweise auch unter den folgenden Namen bekannt:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Technische Spezifikationen
Physical
Case/PackageLFBGA
MountSurface Mount
Number of Pins489
Number of Terminals489
Weight1.035211 g
Technical
Data Bus Width32 b
Frequency417 MHz
Interface2-Wire, I2C, PCI, SPI
Max Frequency66.67 MHz
Max Operating Temperature105 °C
Max Supply Voltage1.05 V
Min Operating Temperature-40 °C
Min Supply Voltage950 mV
Number of Cores1
Number of I/Os56
Number of Programmable I/O56
Number of Timers/Counters3
Operating Supply Voltage1 V
RAM Size48 kB
Schedule B8542310000
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)1.61 mm
Length19 mm
Terminal Pitch800 µm
Width19 mm
Datenblätter und Dokumente
Laden Sie Datenblätter und Herstellerdokumentation für NXP Semiconductors MPC8309CVMAHFCA herunter.
Compliance
Umweltklassifizierung
Radiation HardeningNo
REACH SVHCYes
RoHSCompliant
Compliance-Erklärungen