供应链
Country of OriginTaiwan
Harmonized Tariff Schedule (HTS) Code8542.31.00.60
Introduction Date2016-06-03
Lifecycle StatusProduction (Last Updated: 2 months ago)
描述
由其分销商提供的 AMD XCKU3P-3SFVB784E 的描述。
UltraScale High-Performance FPGA Fastest Speed Grade 355950 Logic Cells 784-Ball FPGA Tray
Kintex UltraScale FPGA, Speed Grade-3, Logic Cells 356K, B784, RoHS
Xilinx SCT
IC FPGA 304 I/O 784FCBGA / series Field Programmable Gate Array (FPGA) IC 304 31641600 355950 784-BFBGA, FCBGA
Field Programmable Gate Array, 20340 CLBS, 355950-Cell, PBGA784
IC MCU 16BIT 96KB FLASH 80LQFP
制造商别名
AMD 在全球拥有多个品牌，分销商可将其用作替代名称。AMD 也可称为以下名称：
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
技术规格
Physical
Case/PackageFBGA
Number of Terminals784
Technical
Max Operating Temperature100 °C
Max Supply Voltage927 mV
Min Operating Temperature0 °C
Min Supply Voltage873 mV
Nominal Supply Voltage (DC)900 mV
Number of Inputs304
Number of Logic Blocks (LABs)20340
Number of Logic Elements/Cells355950
Number of Outputs304
Number of Transceivers0
RAM Size1.7 MB
Speed Grade-3
Dimensions
Height - Seated (Max)3.32 mm
Length23 mm
Terminal Pitch800 µm
Width23 mm