Winbond W988D6FBGX6E

DRAM Chip Mobile LPSDR SDRAM 256Mbit 16Mx16 1.8V 54-Pin VFBGA
NRND

价格与库存

数据表和文档

下载 Winbond W988D6FBGX6E 的数据表和制造商文档。

IHS

Datasheet64 页11 年前

CAD 模型

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来源eCADmCAD文件
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符号封装
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供应链

Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.24
Introduction Date2011-05-19
Lifecycle StatusNRND (Last Updated: 6 months ago)

相关零件

IC DRAM 64M PARALLEL 54TFBGA / 1 Meg Bits x 16 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM
64M, 3.3v, SDRAM, 4Mx16, 166 Mhz, 54 ball BGA (8mmx8mm) RoHS, T&R
64M, 3.3v, SDRAM, 4Mx16, 166 Mhz, 54 ball BGA (8mmx8mm) RoHS, IT, T&R

描述

由其分销商提供的 Winbond W988D6FBGX6E 的描述。

DRAM Chip Mobile LPSDR SDRAM 256Mbit 16Mx16 1.8V 54-Pin VFBGA
EAR99 Surface Mount Tray 8MX32 ic memory 166MHz 5.4ns 8mm 0.00001A
256Mb Mobile LPSDR | IC DRAM 256M PARALLEL 54VFBGA
Synchronous DRAM, 8MX32, 5.4ns, CMOS, PBGA54
IC FLASH 1GBIT SPI/QUAD 24FBGA

制造商别名

Winbond 在全球拥有多个品牌,分销商可将其用作替代名称。Winbond 也可称为以下名称:

  • Winbond Electronics
  • ISD
  • WIN
  • WINBON
  • WINBOND ELECTRONICS CORP
  • Winbond Electronics Corporation
  • WINB
  • WINDBOND
  • WINDOND
  • INFORMATION STORAGE DEVICES
  • Winbond Elec
  • WINBND
  • WINBOD
  • WinbondPb
  • WINBOND/PBF
  • WINBOND ELECTRO
  • WINBOUND
  • Winbond Electronics Corporation America
  • WINBOND Semiconductor
  • WINBONDELE
  • WINBNDELEC
  • WINBOND ELECT CORP
  • WINBOn semiD
  • WINBONB
  • Winbond Corp