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描述
由其分销商提供的 Winbond W987D6HBGX7E 的描述。
DRAM Chip Mobile LPSDR SDRAM 128Mbit 8Mx16 1.8V 54-Pin VFBGA
Synchronous DRAM, 8MX16, 5.4ns, CMOS, PBGA54
e1 Surface Mount Tray 8MX16 ic memory 133MHz 5.4ns 9mm 70mA
IC DRAM 128MBIT PARALLEL 54VFBGA
制造商别名
Winbond 在全球拥有多个品牌，分销商可将其用作替代名称。Winbond 也可称为以下名称：
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
技术规格
Physical
Case/PackageTFBGA
MountSurface Mount
Number of Pins54
Number of Terminals54
Technical
Access Time5.4 ns
Address Bus Width14 b
Density128 Mb
Frequency133 MHz
InterfaceParallel
Max Frequency133 MHz
Max Operating Temperature85 °C
Max Supply Current70 mA
Max Supply Voltage1.95 V
Memory TypeRAM, SDRAM
Min Operating Temperature-25 °C
Min Supply Voltage1.7 V
Nominal Supply Current70 mA
Number of Circuits1
Number of Ports1
Operating Supply Voltage1.8 V
Dimensions
Height - Seated (Max)1.025 mm
Length9 mm
Terminal Pitch800 µm
Width8 mm