供应链
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.02
Introduction Date2011-12-12
Lifecycle StatusEOL (Last Updated: 2 months ago)
LTB Date2026-06-30
LTD Date2026-12-31
描述
由其分销商提供的 Winbond W9864G2JH-6I 的描述。
DRAM Chip SDRAM 64Mbit 2Mx32 3.3V 86-Pin TSOP-II
DRAM 64Mb, SDR SDRAM, x32, 166MHz, 65nm, Ind temp
Synchronous DRAM, 2MX32, 5ns, CMOS, PDSO86
IC DRAM 64MBIT LVTTL 86TSOP II
制造商别名
Winbond 在全球拥有多个品牌，分销商可将其用作替代名称。Winbond 也可称为以下名称：
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
技术规格
Physical
Contact PlatingTin
Number of Terminals86
Technical
Access Time5 ns
Max Frequency166 MHz
Max Operating Temperature85 °C
Max Supply Current130 mA
Max Supply Voltage3.6 V
Min Operating Temperature-40 °C
Min Supply Voltage3 V
Number of Circuits1
Number of Ports1
Operating Supply Voltage3.3 V
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)1.2 mm
Length22.22 mm
Terminal Pitch500 µm
Width10.16 mm