供应链
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.28
Introduction Date2007-12-25
Lifecycle StatusObsolete (Last Updated: 4 months ago)
LTB Date2010-09-01
LTD Date2010-12-01
描述
由其分销商提供的 Winbond W9825G6EH-6 的描述。
IC SDRAM 256MBIT 166MHZ 54TSOP / DRAM Chip SDRAM 256Mbit 16Mx16 3.3V 54-Pin TSOP-II
IC SDRAM 256MBIT 166MHZ 54TSOP
Synchronous DRAM, 16MX16, 5ns, CMOS, PDSO54
IC DRAM 256MBIT PAR 54TSOP II
IC DRAM 256M PARALLEL 54TSOP
1M X 4BANKS X 16BITS SDRAM
制造商别名
Winbond 在全球拥有多个品牌，分销商可将其用作替代名称。Winbond 也可称为以下名称：
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
技术规格
Physical
Case/PackageTSOP
MountSurface Mount
Number of Pins54
Number of Terminals54
Technical
Access Time5 ns
Address Bus Width15 b
Data Bus Width16 b
Density256 Mb
Frequency166 MHz
InterfaceParallel
Max Frequency166 MHz
Max Operating Temperature70 °C
Max Supply Current100 mA
Max Supply Voltage3.6 V
Memory TypeRAM, SDRAM
Min Operating Temperature0 °C
Min Supply Voltage3 V
Nominal Supply Current150 mA
Number of Circuits1
Number of Ports1
Operating Supply Voltage3.3 V
Temperature GradeCommercial
Dimensions
Height - Seated (Max)1.2 mm
Length22.22 mm
Terminal Pitch800 µm
Width10.16 mm