供应链
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.02
Introduction Date2012-03-05
Lifecycle StatusObsolete (Last Updated: 4 months ago)
LTB Date2014-05-30
LTD Date2014-08-29
描述
由其分销商提供的 Winbond W9812G6JB-6I 的描述。
2M x 4 BANKS 꼌 16 BITS SDRAM | IC DRAM 128M PARALLEL 54TFBGA
DRAM Chip SDRAM 128M-Bit 8Mx16 3.3V 54-Pin TFBGA
EAR99 Surface Mount Tray 8MX16 ic memory 166MHz 5ns 8mm 75mA
Synchronous DRAM, 8MX16, 5ns, CMOS, PBGA54
Synchronous Dynamic Random Access Memory (SDRAM)
DRAM 128Mb SDR SDRAM x16, 166MHz, Ind temp
IC SDRAM 128MBIT 166MHZ 54TFBGA
制造商别名
Winbond 在全球拥有多个品牌，分销商可将其用作替代名称。Winbond 也可称为以下名称：
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
技术规格
Physical
Case/PackageTFBGA
MountSurface Mount
Number of Pins54
Number of Terminals54
Technical
Access Time5 ns
Address Bus Width14 b
Density128 Mb
Frequency166 MHz
InterfaceParallel
Max Frequency166 MHz
Max Operating Temperature85 °C
Max Supply Current75 mA
Max Supply Voltage3.6 V
Memory TypeRAM, SDRAM
Min Operating Temperature-40 °C
Min Supply Voltage3 V
Nominal Supply Current75 mA
Number of Circuits1
Number of Ports1
Operating Supply Voltage3.3 V
Schedule B8542320015
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)1.2 mm
Length8 mm
Terminal Pitch800 µm
Width8 mm