供应链
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.28
Introduction Date2014-08-25
Lifecycle StatusNRND (Last Updated: 4 months ago)
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MicronEDB1332BDBH-1DAAT-F-R
DRAM Chip Mobile LPDDR2 SDRAM 1Gbit 32Mx32 1.2V/1.8V Automotive 134-Pin FBGA T/R
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512KB 128 k x 36 3.135V 360mA 3.465V 200MHz Parallel PBGA-119 14mm*22mm*2.15mm
Renesas71V547S75PFG
Discontinued 2015 Parallel RAM SDR SRAM (Memory Format) Memory 70C 3.465V 4.5Mb 14mm
描述
由其分销商提供的 Winbond W979H2KBVX2I 的描述。
512Mb £¨16M x 32£© 16Mx32 1.14V 175mA 1.95V 400MHz Parallel 32bit BGA 11.5mm*10mm*580¦Ìm
DRAM Chip Mobile LPDDR2 SDRAM 512Mbit 16Mx32 1.2V/1.8V 134-Pin VFBGA
Surface Mount Tray 16MX32 SDRAM - Mobile LPDDR2 ic memory 400MHz 15ns 10mm 536870912bit
Synchronous Dynamic Random Access Memory (SDRAM)
LPDDR2 DRAM, 16MX32, CMOS, PBGA134
IC DRAM 512M PARALLEL 134VFBGA
DRAM 512Mb LPDDR2, x32, 400MHz, -40 85C
制造商别名
Winbond 在全球拥有多个品牌，分销商可将其用作替代名称。Winbond 也可称为以下名称：
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
技术规格
Physical
Number of Pins134
Number of Terminals134
Technical
Frequency400 MHz
InterfaceParallel
Max Operating Temperature85 °C
Max Supply Voltage1.3 V
Memory TypeRAM, SDRAM
Min Operating Temperature-40 °C
Min Supply Voltage1.14 V
Number of Circuits1
Number of Ports1
Operating Supply Voltage1.2 V
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)1 mm
Length11.5 mm
Terminal Pitch650 µm
Width10 mm