Winbond W979H2KBQX2I

DRAM Chip Mobile LPDDR2 SDRAM 512Mbit 16Mx32 1.2V/1.8V 168-Pin WFBGA
Production
制造商页面数据表

价格与库存

数据表和文档

下载 Winbond W979H2KBQX2I 的数据表和制造商文档。

官方数据表15 年前

供应链

Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.28
Introduction Date2014-08-25
Lifecycle StatusProduction (Last Updated: 4 months ago)

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ISSIIS43LD16640A-25BLI
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ISSIIS43LD16640A-25BL
DRAM Chip Mobile LPDDR2 S4 SDRAM 1G-Bit 64Mx16 1.2V/1.8V 134-Pin TF-BGA
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ISSIIS43LD32320A-25BL
DRAM Chip Mobile LPDDR2 S4 SDRAM 1G-Bit 32Mx32 1.2V/1.8V 134-Pin F-BGA
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MicronEDB5432BEPA-1DAAT-F-R
DRAM Chip LPDDR2 SDRAM 512M-Bit 16Mx32 1.2V/1.8V 168-Pin WFBGA T/R
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Renesas71V3577S80BQ
3.3V 128K x 36 Synchronous Flowthrough SRAM with 3.3V I/O
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MicronEDB5432BEBH-1DAAT-F-R
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描述

由其分销商提供的 Winbond W979H2KBQX2I 的描述。

DRAM Chip Mobile LPDDR2 SDRAM 512Mbit 16Mx32 1.2V/1.8V 168-Pin WFBGA
Verical
BALL Parallel BOTTOM RAM SDRAM ic memory 85C 1.14V 536870912bit 12mm
Fly-Wing Technology
LPDDR2 DRAM, 16MX32, CMOS, PBGA168
IHS
IC SDRAM 512MBIT 400MHZ 168WFBGA
YIC International
DRAM 512Mb LPDDR2, x32, 400MHz, -40 ~ 85C
Digi-ic_SMART PIONEER
IC DRAM 512M PARALLEL 168WFBGA
SHENGYU ELECTRONICS

图片

UTSource
Augswan

制造商别名

Winbond 在全球拥有多个品牌，分销商可将其用作替代名称。Winbond 也可称为以下名称：

  • Winbond Electronics
  • ISD
  • WIN
  • WINBON
  • WINBOND ELECTRONICS CORP
  • Winbond Electronics Corporation
  • WINB
  • WINDBOND
  • WINDOND
  • INFORMATION STORAGE DEVICES
  • Winbond Elec
  • WINBND
  • WINBOD
  • WinbondPb
  • WINBOND/PBF
  • WINBOND ELECTRO
  • WINBOUND
  • Winbond Electronics Corporation America
  • WINBOND Semiconductor
  • WINBONDELE
  • WINBNDELEC
  • WINBOND ELECT CORP
  • WINBOn semiD
  • WINBONB
  • Winbond Corp