供应链
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.28
Introduction Date2011-12-15
Lifecycle StatusEOL (Last Updated: 1 month ago)
LTB Date2026-06-30
LTD Date2026-12-31
相关零件
MicronMT47H32M16NF-25E:H
512Mb £¨32M x 16£© 32Mx16 1.7V 160mA 1.9V 400MHz Parallel 16bit FBGA-84 12.5mm*8mm*1.1mm
MicronMT47H64M8SH-25E:H
1.9 V 512 Mbit Parallel 400 MHz 400 ps SMT U88B SDRAM DDR2 Memory IC - FBGA-60
描述
由其分销商提供的 Winbond W9751G6KB25I 的描述。
Double Data Rate architecture: two data transfers per clock cycle | IC DRAM 512M PARALLEL 84WBGA
DRAM Chip DDR2 SDRAM 512Mbit 32Mx16 1.8V 84-Pin WBGA
EAR99 Surface Mount Tray 32MX16 ic memory 400MHz 400ps 12.5mm 165mA
DDR2 DRAM, 32MX16, 0.4ns, CMOS, PBGA84
IC DRAM 512MBIT PARALLEL 84WBGA
制造商别名
Winbond 在全球拥有多个品牌，分销商可将其用作替代名称。Winbond 也可称为以下名称：
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
技术规格
Physical
Case/PackageTFBGA
MountSurface Mount
Number of Pins84
Number of Terminals84
Technical
Access Time400 ps
Address Bus Width15 b
Density512 Mb
InterfaceParallel
Max Frequency400 MHz
Max Operating Temperature85 °C
Max Supply Current200 mA
Max Supply Voltage1.9 V
Memory TypeDDR2 SDRAM, RAM
Min Operating Temperature-40 °C
Min Supply Voltage1.7 V
Nominal Supply Current165 mA
Number of Circuits1
Number of Ports1
Operating Supply Voltage1.8 V
Schedule B8542320015
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)1.2 mm
Length12.5 mm
Terminal Pitch800 µm
Width8 mm