供应链
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.28
Introduction Date2011-12-15
Lifecycle StatusEOL (Last Updated: 1 month ago)
LTB Date2020-11-02
LTD Date2021-02-01
描述
由其分销商提供的 Winbond W9751G6KB-18 的描述。
Double Data Rate architecture: two data transfers per clock cycle | IC DRAM 512M PARALLEL 84WBGA
DRAM Chip DDR2 SDRAM 512M-Bit 32Mx16 1.8V 84-Pin WBGA
EAR99 Surface Mount Tray 32MX16 ic memory 533MHz 350ps 12.5mm 200mA
DDR2 DRAM, 32MX16, 0.35ns, CMOS, PBGA84
IC MCU 32BIT 128KB FLASH 64LQFP
IC DRAM 512MBIT PARALLEL 84WBGA
制造商别名
Winbond 在全球拥有多个品牌，分销商可将其用作替代名称。Winbond 也可称为以下名称：
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
技术规格
Physical
Case/PackageTFBGA
MountSurface Mount
Number of Pins84
Number of Terminals84
Technical
Access Time350 ps
Address Bus Width15 b
Density512 Mb
InterfaceParallel
Max Frequency533 MHz
Max Operating Temperature85 °C
Max Supply Current245 mA
Max Supply Voltage1.9 V
Memory TypeDDR2 SDRAM, RAM
Min Operating Temperature0 °C
Min Supply Voltage1.7 V
Nominal Supply Current200 mA
Number of Circuits1
Number of Ports1
Operating Supply Voltage1.8 V
Schedule B8542320015
Dimensions
Height - Seated (Max)1.2 mm
Length12.5 mm
Terminal Pitch800 µm
Width8 mm