供应链
Country of OriginTaiwan
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.28
Introduction Date2014-01-06
Lifecycle StatusProduction (Last Updated: 1 month ago)
相关零件
ISSIIS43R16160F-5BLI
256Mb （16M x 16） 16Mx16 2.3V 200mA 2.7V 200MHz Parallel 16bit BGA SMD mount 13mm*8mm*800μm
ISSIIS42S16400J-7BLI
IC DRAM 64M PARALLEL 54TFBGA / 1 Meg Bits x 16 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM
描述
由其分销商提供的 Winbond W949D2DBJX5I 的描述。
Winbond SDRAM, 512Mbit, VFBGA, 32Bit Data Bus, 64M x 8 bit, 200MHz, 90-Pin
R-PBGA-B90 Surface Mount Tray 16MX32 ic memory 200MHz 5ns 8mm 536870912bit
DRAM Chip Mobile LPDDR SDRAM 512Mbit 16Mx32 1.8V 90-Pin VFBGA
512Mbit 1.7V~1.95V 200MHz LPDDR SDRAM VFBGA-90(8x13) Memory RoHS
LPDDR1 DRAM, 16MX32, 5ns, CMOS, PBGA90
IC DRAM 512MBIT PARALLEL 90VFBGA
VFBGA90 512MB LP DDR X32 200MH
DUAL BIT, LOW-POWER, VOLTAGE-OUT
制造商别名
Winbond 在全球拥有多个品牌，分销商可将其用作替代名称。Winbond 也可称为以下名称：
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
技术规格
Physical
Case/PackageTFBGA
Number of Terminals90
Technical
Access Time5 ns
Frequency200 MHz
Max Operating Temperature85 °C
Max Supply Voltage1.95 V
Memory TypeLPDDR, RAM, SDRAM
Min Operating Temperature-40 °C
Min Supply Voltage1.7 V
Nominal Supply Voltage (DC)1.8 V
Number of Circuits1
Number of Ports1
Schedule B8542320015
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)1.025 mm
Length13 mm
Terminal Pitch800 µm
Width8 mm