供应链
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.02
Introduction Date2011-06-21
Lifecycle StatusNRND (Last Updated: 4 months ago)
相关零件
ISSIIS42S16400J-6BLI
IC DRAM 64M PARALLEL 54TFBGA / 1 Meg Bits x 16 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM
MicronMT47H64M8SH-25E:H
1.9 V 512 Mbit Parallel 400 MHz 400 ps SMT U88B SDRAM DDR2 Memory IC - FBGA-60
MicronMT47H128M8SH-25E:M
1Gb (128M x 8) 128Mx8 1.7V 120mA 1.9V 400MHz Parallel 8bit FBGA-60 10mm*8mm*1.1mm
MicronMT41K128M8DA-107:J
1.45 V 1 Gbit Parallel 933 MHz 20 ns SMT V88A SDRAM DDR3L Memory IC - FBGA-78
描述
由其分销商提供的 Winbond W947D6HBHX6E 的描述。
DRAM Chip Mobile LPDDR SDRAM 128Mbit 8Mx16 1.8V 60-Pin VFBGA
128Mb Mobile LPDDR | IC DRAM 128M PARALLEL 60VFBGA
EAR99 Surface Mount Tray 8MX16 ic memory 166MHz 5ns 9mm 50mA
LPDDR1 DRAM, 8MX16, 5ns, CMOS, PBGA60
DRAM 128Mb LPDDR, x16, 166MHz, 65nm
制造商别名
Winbond 在全球拥有多个品牌，分销商可将其用作替代名称。Winbond 也可称为以下名称：
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
技术规格
Physical
Case/PackageTFBGA
MountSurface Mount
Number of Pins60
Number of Terminals60
Technical
Access Time5 ns
Address Bus Width14 b
Data Bus Width16 b
Density128 Mb
Frequency166 MHz
InterfaceParallel
Max Frequency166 MHz
Max Operating Temperature85 °C
Max Supply Current70 mA
Max Supply Voltage1.95 V
Memory TypeLPDDR, RAM, SDRAM
Min Operating Temperature-25 °C
Min Supply Voltage1.7 V
Nominal Supply Current50 mA
Number of Circuits1
Number of Ports1
Operating Supply Voltage1.8 V
Dimensions
Height - Seated (Max)1.025 mm
Length9 mm
Terminal Pitch800 µm
Width8 mm