描述
由其分销商提供的 Winbond W66CP2NQUAFJ 的描述。
IC DRAM 4GBIT LVSTL 11 200WFBGA
LPDDR4 DRAM, 128MX32, 3.5ns, CMOS
4GB LPDDR4, DDP, X32, 1600MHZ, -
制造商别名
Winbond 在全球拥有多个品牌，分销商可将其用作替代名称。Winbond 也可称为以下名称：
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
技术规格
Physical
Number of Terminals200
Technical
Access Time3.5 ns
Max Frequency1.6 GHz
Max Operating Temperature105 °C
Max Supply Current300 mA
Max Supply Voltage1.17 V
Min Operating Temperature-40 °C
Min Supply Voltage1.06 V
Number of Circuits1
Number of Ports1
Operating Supply Voltage1.1 V
Dimensions
Height - Seated (Max)800 µm
Length14.5 mm
Terminal Pitch800 µm
Width10 mm