描述
由其分销商提供的 Winbond W63AH2NBVABE 的描述。
LPDDR3 DRAM, 32MX32, CMOS, PBGA178
VFBGA178 1GB LP DDR3 X32 800MH
IC DRAM 1GBIT HSUL 12 178VFBGA
LPDDR3 1Gbit 32M x 32 800MHz
DRAM 1Gb LPDDR3, x32, 800MHz
LPDDR3 DRAM Chip
制造商别名
Winbond 在全球拥有多个品牌，分销商可将其用作替代名称。Winbond 也可称为以下名称：
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
技术规格
Physical
Number of Terminals178
Technical
Max Frequency800 MHz
Max Operating Temperature85 °C
Max Supply Current36 mA
Max Supply Voltage1.3 V
Min Operating Temperature-25 °C
Min Supply Voltage1.14 V
Number of Circuits1
Number of Ports1
Operating Supply Voltage1.2 V
Dimensions
Height - Seated (Max)1 mm
Length11.5 mm
Terminal Pitch800 µm
Width11 mm