供应链
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.32
Introduction Date2020-12-11
Lifecycle StatusProduction (Last Updated: 4 months ago)
描述
由其分销商提供的 Winbond W631GU6NB12I 的描述。
DDR3L DRAM, 64MX16, 20ns, CMOS, PBGA96
IC DRAM 1GBIT PARALLEL 96VFBGA
1GB DDR3L 1.35V SDRAM, X16, INDU
DDR3-1600 64Mx16 (1Gb) 1.35V Ind
制造商别名
Winbond 在全球拥有多个品牌，分销商可将其用作替代名称。Winbond 也可称为以下名称：
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
技术规格
Physical
Number of Terminals96
Technical
Access Time20 ns
Max Frequency800 MHz
Max Operating Temperature95 °C
Max Supply Current220 mA
Max Supply Voltage1.45 V
Min Operating Temperature-40 °C
Min Supply Voltage1.283 V
Number of Circuits1
Number of Ports1
Operating Supply Voltage1.35 V
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)1 mm
Length13 mm
Terminal Pitch800 µm
Width7.5 mm