供应链
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.32
Introduction Date2021-01-07
Lifecycle StatusProduction (Last Updated: 5 months ago)
描述
由其分销商提供的 Winbond W631GG8NB15I 的描述。
DDR3 DRAM, 128MX8, 20ns, CMOS, PBGA78
DRAM 1Gb DDR3 SDRAM, x8, 667MHz, Industrial Temp
IC DRAM 1GBIT SSTL 15 78VFBGA
DDR3-1333 128Mx8 (1Gb) Ind
Low Power Chip DDR3
制造商别名
Winbond 在全球拥有多个品牌，分销商可将其用作替代名称。Winbond 也可称为以下名称：
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
技术规格
Physical
Number of Terminals78
Technical
Access Time20 ns
Max Frequency667 MHz
Max Operating Temperature95 °C
Max Supply Current175 mA
Max Supply Voltage1.575 V
Min Operating Temperature-40 °C
Min Supply Voltage1.425 V
Number of Circuits1
Number of Ports1
Operating Supply Voltage1.5 V
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)1 mm
Length10.5 mm
Terminal Pitch800 µm
Width8 mm