供应链
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.32
Introduction Date2012-03-08
Lifecycle StatusObsolete (Last Updated: 4 months ago)
LTB Date2018-02-01
LTD Date2018-05-01
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描述
由其分销商提供的 Winbond W631GG6KB-15 的描述。
DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96-Pin WBGA
EAR99 Surface Mount Tray 64MX16 ic memory 667MHz 20ns 13mm 240mA
DDR3 DRAM, 64MX16, 0.255ns, CMOS, PBGA96
IC DRAM 1GBIT PARALLEL 96WBGA
IC SDRAM 1GBIT 667MHZ 96BGA
new, original packaged
制造商别名
Winbond 在全球拥有多个品牌，分销商可将其用作替代名称。Winbond 也可称为以下名称：
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
技术规格
Physical
Case/PackageTFBGA
MountSurface Mount
Number of Pins96
Number of Terminals96
Technical
Access Time255 ps
Address Bus Width16 b
Data Bus Width16 b
Density1 Gb
Frequency667 MHz
InterfaceParallel
Max Frequency667 MHz
Max Operating Temperature85 °C
Max Supply Current380 mA
Max Supply Voltage1.575 V
Memory TypeDDR3 SDRAM, RAM
Min Operating Temperature0 °C
Min Supply Voltage1.425 V
Nominal Supply Current240 mA
Number of Circuits1
Number of Ports1
Operating Supply Voltage1.5 V
Dimensions
Height - Seated (Max)1.2 mm
Length13 mm
Terminal Pitch800 µm
Width9 mm