供应链
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.51
Introduction Date2015-02-10
Lifecycle StatusProduction (Last Updated: 3 weeks ago)
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描述
由其分销商提供的 Winbond W29N02GVSIAA 的描述。
SLC NAND Flash Parallel 3V/3.3V 2G-bit 256M x 8 25ns Automotive 48-Pin TSOP-I
Winbond 2Gbit SLC NAND, , TSOP-48, 18.5 x 12.1 x 1.05mm
2G-BIT 3.3V NAND FLASH MEMORY Flash, 2GX1, PDSO48
3A991.B.1.A Surface Mount Tray 2GX1 ic memory 25ns 12mm 2Gb 2.7V
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TSOP48 2GB SLC NAND X8 3V LEGA
制造商别名
Winbond 在全球拥有多个品牌，分销商可将其用作替代名称。Winbond 也可称为以下名称：
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
技术规格
Physical
Case/PackageTSSOP
Contact PlatingTin
MountSurface Mount
Number of Pins48
Number of Terminals48
Technical
Access Time25 ns
Ambient Temperature Range High85 °C
Density2 Gb
InterfaceParallel, Serial
Max Operating Temperature85 °C
Max Supply Current35 mA
Max Supply Voltage3.6 V
Memory Size256 MB
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage2.7 V
Number of Circuits1
Operating Supply Voltage3.3 V
Page Size256 B
Schedule B8542320070
Temperature GradeIndustrial
Dimensions
Height1.2 mm
Height - Seated (Max)1.2 mm
Length18.4 mm
Terminal Pitch500 µm
Width12 mm