供应链
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.51
Introduction Date2016-07-01
Lifecycle StatusProduction (Last Updated: 5 months ago)
相关零件
MicronMT29F1G08ABADAWP-IT:D
IC FLASH 1GBIT 20NS 48TSOP / SLC NAND Flash Parallel 3.3V 1G-bit 128M x 8 48-Pin TSOP-I Tray
MacronixMX29LV320EBTI-70G
Flash Memory, Parallel NOR, 32 Mbit, 4M x 8bit / 2M x 16bit, CFI, Parallel, TSOP, 48 Pins
描述
由其分销商提供的 Winbond W29N01HVSINA 的描述。
SLC NAND Flash 3V/3.3V 1G-bit 128M x 8 48-Pin TSOP-I | IC FLASH 1G PARALLEL 48TSOP
Active 2016 DUAL Non-Volatile FLASH Memory -40C~85C TA 2.7V 1Gb 18.4mm
Winbond 1Gbit SLC NAND, , TSOP-48, 18.5 x 12.1 x 1.05mm
TSOP-48-18.4mm NAND FLASH ROHS
IC FLASH 1GBIT PARALLEL 48TSOP
TSOP48 1GB NAND FLASH 3V 1B EC
制造商别名
Winbond 在全球拥有多个品牌，分销商可将其用作替代名称。Winbond 也可称为以下名称：
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
技术规格
Physical
Case/PackageTFSOP
MountSurface Mount
Number of Pins48
Number of Terminals48
Technical
Access Time25 ns
Address Bus Width28 b
Density1 Gb
InterfaceParallel
Max Operating Temperature85 °C
Max Supply Current35 mA
Max Supply Voltage3.6 V
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage2.7 V
Number of Circuits1
Operating Supply Voltage3.3 V
Page Size2.1 kB
Schedule B8542320070
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)1.2 mm
Length18.4 mm
Terminal Pitch500 µm
Width12 mm