供应链
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.51
Introduction Date2016-07-01
Lifecycle StatusProduction (Last Updated: 5 months ago)
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SLC NAND Flash Parallel 1.8V 2G-bit 256M x 8 63-Pin VFBGA Tray / IC FLASH 2GBIT 63VFBGA
描述
由其分销商提供的 Winbond W29N01HVBINF 的描述。
Surface Mount Tray 128MX8 FLASH - NAND (SLC) ic memory 25ns 9mm 1073741824bit 2.7V
SLC NAND Flash Parallel 3V/3.3V 1G-bit 128M x 8 63-Pin VFBGA
2.7V~3.6V 1Gbit VFBGA-63(9x11) NAND FLASH ROHS
Winbond 1Gbit SLC NAND, , VFBGA-63, 11.1 x 9.1 x 0.6mm
IC FLASH 1GBIT PARALLEL 63VFBGA
VFBGA63 1GB L NAND FLASH 3V 4B
制造商别名
Winbond 在全球拥有多个品牌，分销商可将其用作替代名称。Winbond 也可称为以下名称：
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
技术规格
Physical
Number of Pins63
Number of Terminals63
Technical
InterfaceParallel
Max Operating Temperature85 °C
Max Supply Current35 mA
Max Supply Voltage3.6 V
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage2.7 V
Nominal Supply Voltage (DC)3.3 V
Number of Circuits1
Schedule B8542320070
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)1 mm
Length11 mm
Terminal Pitch800 µm
Width9 mm