供应链
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.51
Introduction Date2003-09-10
Lifecycle StatusObsolete (Last Updated: 4 months ago)
LTB Date2007-10-31
LTD Date2008-02-29
描述
由其分销商提供的 Winbond W25P16VSSIG 的描述。
IC FLASH 16MBIT 50MHZ 8SOIC
IC MCU 32BIT 512KB FLASH 144TQFP
Flash, 2MX8, PDSO8
制造商别名
Winbond 在全球拥有多个品牌，分销商可将其用作替代名称。Winbond 也可称为以下名称：
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
技术规格
Physical
Case/PackageSOP
Number of Pins8
Number of Terminals8
Technical
Access Time50 µs
Address Bus Width1 b
Density16 Mb
Frequency50 MHz
InterfaceSerial
Max Frequency25 MHz
Max Operating Temperature85 °C
Max Supply Current32 mA
Max Supply Voltage3.6 V
Memory Size15.3 MB
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage2.7 V
Number of Circuits1
Operating Supply Voltage3 V
PackagingBulk
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)2.16 mm
Length5.27 mm
Terminal Pitch1.27 mm
Width5.27 mm