供应链
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.51
Introduction Date2018-11-21
Lifecycle StatusProduction (Last Updated: 9 months ago)
描述
由其分销商提供的 Winbond W25N512GVEIG 的描述。
SLC NAND Flash Serial-SPI 3.3V 512M-bit 8-Pin WSON EP Tray
64MB 64 M x 8 2.7V 3.6V 104MHz Serial-SPI 8bit WSON-8
IC FLASH 512MBIT SPI/QUAD 8WSON
制造商别名
Winbond 在全球拥有多个品牌，分销商可将其用作替代名称。Winbond 也可称为以下名称：
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
技术规格
Physical
Number of Terminals8
Technical
InterfaceSerial
Max Frequency166 MHz
Max Operating Temperature85 °C
Max Supply Current35 mA
Max Supply Voltage3.6 V
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage2.7 V
Nominal Supply Voltage (DC)3 V
Number of Circuits1
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)800 µm
Length8 mm
Terminal Pitch1.27 mm
Width6 mm