供应链
Country of OriginMainland China
Export Control Classification Number (ECCN) CodeEAR99
Introduction Date2007-06-25
Lifecycle StatusEOL (Last Updated: 3 years ago)
LTB Date2023-03-31
LTD Date2024-03-31
Manufacturer Lifecycle StatusEOL ANNOUNCED (Last Updated: 3 years ago)
描述
由其分销商提供的 TDK HHM1726P1 的描述。
Baluns, Pass Band=880 to 960MHz, Bal. Port Zc=100Ohm
Signal Conditioning GSM900 Tx & Rx Multlayer Balun XFMR
Multilayer Chip Balun 6-Pin SMD Blister T/R
BALUN 880MHZ-960MHZ 50/100 0603
-/Tape And Reel |Tdk HHM1726P1
制造商别名
TDK 在全球拥有多个品牌，分销商可将其用作替代名称。TDK 也可称为以下名称：
- TDK Corporation
- TDK CORP
- TDK CORPORATION OF AMERICA
- TDK InvenSense
- TDK Electronics Inc
- TDK COMPONENTS
- TDK ELECTRONICS
- FORD
- TDK SEMICONDUCTOR
- TDK-Lambda Americas
- TDK Epcos
- TDK Semiconductor Corporation
- TDK ELECTRONICS EUROPE
- TDK Semiconductor Corp
- TDK HONG KONG COMPANY LIMITED
- TDK(RoHS)
- TDK SEMIC
- TDK CORPORATION (VA)
- TDK CORP OF AMERICA
- TDK ELECTRONIC
- TDK ELECTRON
- TDK HONGKONG CO LTD
- TDK - Teridian
- TDK-EPC
- TDK Corporation [CI]
- Invensense
- Epcos
技术规格
Physical
Case/Package0603
Case Code (Imperial)0603
Case Code (Metric)1608
MountSurface Mount
Number of Pins6
Technical
Insertion Loss (dB)0.8 dB
Max Operating Temperature85 °C
Min Operating Temperature-40 °C
PackagingCut Tape (CT)
TerminationSMD/SMT
Dimensions
Height600 µm
Length1.6 mm
Max Length1.7 mm
Max Thickness700 µm
Max Width900 µm
Min Length1.5 mm
Min Thickness500 µm
Min Width700 µm
Width800 µm