供应链
Export Control Classification Number (ECCN) Code3A991.A.2
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2000-10-13
Lifecycle StatusObsolete (Last Updated: 4 months ago)
LTB Date2013-12-03
LTD Date2014-12-03
描述
由其分销商提供的 NXP Semiconductors MPC823CZQ66B2T 的描述。
MPU MPC8xx RISC 32-Bit 66MHz 3.3V 256-Pin BGA Tray
PowerPC Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 256-PBGA (23x23)
RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA256
; Series:PowerQUICC I; Core Size:32 bit; Leaded Process Compatible:No; No. of Bits:32 bit; Peak Reflow Compatible (260 C):No ;RoHS Compliant: No
制造商别名
NXP Semiconductors 在全球拥有多个品牌，分销商可将其用作替代名称。NXP Semiconductors 也可称为以下名称：
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
技术规格
Physical
Case/PackageBGA
MountSurface Mount
Number of Pins256
Number of Terminals256
Weight1.724048 g
Technical
Core ArchitecturePowerPC
Data Bus Width32 b
Frequency66 MHz
InterfaceEthernet, I2C, Serial, UART
Max Frequency5 MHz
Max I/O Voltage3.3 V
Max Operating Temperature70 °C
Max Supply Voltage3.6 V
Memory Size32 kB
Min Operating Temperature0 °C
Min Supply Voltage3 V
Number of Cores1
Operating Supply Voltage3.3 V
RAM Size8 kB
Temperature GradeCommercial
Dimensions
Height - Seated (Max)2.35 mm
Length23 mm
Terminal Pitch1.27 mm
Width23 mm
合规
环境分类
Halogen FreeHalogen Free
Lead FreeContains Lead
Radiation HardeningNo
REACH SVHCNo
RoHSNon-Compliant
合规声明