供应链
Export Control Classification Number (ECCN) Code3A991.A.1
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2001-12-18
Lifecycle StatusObsolete (Last Updated: 4 months ago)
LTB Date2016-09-30
LTD Date2017-03-31
相关零件
NXP SemiconductorsMPC755BPX300LE
MPU PowerPC MPC7xx Processor RISC 64-Bit 0.22um 300MHz 2.5V/3.3V 360-Pin FCBGA Tray
NXP SemiconductorsMPC755CPX350LE
MPU PowerPC MPC7xx Processor RISC 64-Bit 0.22um 350MHz 2.5V/3.3V 360-Pin FCBGA Tray
NXP SemiconductorsMPC745BPX300LE
MPU PowerPC MPC7xx Processor RISC 64-Bit 0.22um 300MHz 2.5V/3.3V 255-Pin FCBGA Tray
描述
由其分销商提供的 NXP Semiconductors MPC755BVT300LE 的描述。
MPU PowerPC MPC7xx Processor RISC 64-Bit 0.22um 300MHz 2.5V/3.3V 360-Pin FCBGA Tray
PowerPC Microprocessor IC MPC7xx 1 Core, 32-Bit 300MHz 360-FCPBGA (25x25)
RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360
IC MPU MPC7XX 300MHZ 360FCPBGA
制造商别名
NXP Semiconductors 在全球拥有多个品牌，分销商可将其用作替代名称。NXP Semiconductors 也可称为以下名称：
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
技术规格
Physical
Case/PackageBGA
MountSurface Mount
Number of Pins360
Number of Terminals360
Weight2.382409 g
Technical
Core ArchitecturePowerPC
Data Bus Width32 b
Frequency300 MHz
Max Frequency100 MHz
Max I/O Voltage3.3 V
Max Operating Temperature105 °C
Max Supply Voltage2.1 V
Min Operating Temperature0 °C
Min Supply Voltage1.8 V
Number of Cores1
Operating Supply Voltage2 V
Dimensions
Height - Seated (Max)2.77 mm
Length25 mm
Terminal Pitch1.27 mm
Width25 mm
合规
环境分类
China RoHSNon-Compliant
Halogen FreeHalogen Free
Lead FreeLead Free
REACH SVHCNo
RoHSCompliant
合规声明