描述
由其分销商提供的 Multicomp MCBB830 的描述。
BREADBOARD, SOLDERLESS, ABS; Board Type:; Type:Breadboard / Solderless; Material:ABS (Acrylonitrile
Soldering Material/Accessories
BREAD BOARD, ABS, SOLDERLESS, 56 X 165MM; Breadboard Type: Solderless Breadboard; Total Number of Tie Points: 830Tie Points; No. of Distribution Strips / Buses: 2Bus Strips; No. of Term; Available until stocks are exhausted
Breadboard, Solderless, Abs; Tipo De Placa:Placa De Pruebas/Sin Soldadura; Material De Placa:Abs (Acrilonitrilo Butadieno Estireno); Diámetro Del Orificio:-; Altura Externa:56Mm; Anchura Externa:165Mm; Grosor De Placa:8.5Mm |Multicomp MCBB830
制造商别名
Multicomp 在全球拥有多个品牌，分销商可将其用作替代名称。Multicomp 也可称为以下名称：
- MULTICOMP PRO
- MULTICOMP CORPORATION
- MULTICOMP (FORMERLY FROM SPC)
- MULTICOMP FARNELL
- MULTCMP
- SPC Technology/ Multicomp
- MULTICOMP (FORMERLY FROM VOLTREX)
- MULTICOMP/OTHER MFR
- MULTICOM
- SPC Technology
- MULTICOMP / FEC 1864419RL
- MULTICOMP PRO / NEWARK ELECTRONICS
- NELTRON INDUSTRIAL CO LTD
- PRO Power SPC
- FREEPORT RESOURCES ENTERPRISES CORP
- Multicomp VOLTREX
- MULTICOMP / PARTNER STOCK
- MULTICOMP(RoHS)
- Microdiode Electronics
- MULTICOMP (MC)
- Multicomp [SPC]