价格与库存
| Distributor | SKU | Min | Pkg | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Verical | 533642070 | 4,000 | 74 | |||||||||
| Powell Electronics | 53364-2070 | 3,300 | 80 | 10h | ||||||||
| JRH Electronics | 53364-2070 | 5,000 | 80 | 19h | ||||||||
| TME | 533642070-MOL-0 | 5,000 | 75 | 23h | ||||||||
| Farnell | 53364-2070 | 4,500 | 80 | 7h |
供应链
Country of OriginJP
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8536.69.40.40
Introduction Date2013-06-06
Lifecycle StatusProduction (Last Updated: 5 years ago)
LTB Date2022-06-01
LTD Date2022-09-01
Manufacturer Lifecycle StatusACTIVE (Last Updated: 5 years ago)
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描述
由其分销商提供的 Molex 53364-2070 的描述。
Header,Outer Shroud Contacts 800¦Ìm 2 20pin 6mm,7mm 5.15mm 9.8mm*5.1mm
Conn Board to Board HDR 20 POS 0.8mm Solder ST SMD Automotive T/R
0.8 Btb Wafer Assy St Smt 20Cktembstppkg |Molex 53364-2070
0.80mm Pitch Board-to-Board Header Surface Mount Dual Row Vertical 6.00mm Stacking Height with Plastic Pegs 20 Circuits
SlimStack Board-to-Board Connector. 0.80mm Pitch, Floating Series, Plug, 6.00 or 7.00mm Mated Height, 20 Circuits, Vertical, with Boss
制造商别名
Molex 在全球拥有多个品牌，分销商可将其用作替代名称。Molex 也可称为以下名称：
- MOLEX INC
- MOL
- MLX
- Molex LLC
- Molex Connector Corporation
- MOLE
- MOLX
- MOLEX INCORPORATED
- MOLEX ELECTRONICS
- MOLEX CONNECTOR CORP
- MOLEX HONG KONG CHINA LTD
- MOLEX INTERCONNECT GMBH
- Molex / FCT
- MXA
- Molex Taiwan Ltd
- Molex - Oplink Communications LLC
- MOLEX-ETC
- MOLEX PREMISE NETWORK
- MOLEX GMBH
- MOLEX INDUSTRIAL HDC
- MOELX
- MOLEX INDUSTRIAL
- MOLEX ELEKTRONIK GMBH
- MOLEX INTERCONNECT
- MOLEX CONNECTOR
- Molex, LLC
技术规格
Physical
Contact MaterialBronze
Contact PlatingTin
Housing ColorNatural
Housing MaterialPolyphenylene
MountSurface Mount
Number of Pins20
PlatingTin
Technical
Contact Resistance20 mΩ
Current Rating500 mA
GenderMale
Insulation Resistance100 MΩ
Max Operating Temperature105 °C
Min Operating Temperature-20 °C
Number of Circuits20
Number of Contacts20
Number of Positions20
Number of Rows2
OrientationVertical
Plating Thickness1.016 µm
Schedule B8536694040
TerminationSolder
Dimensions
Depth5.1 mm
Length9.8 mm
Mated Stacking Heights7 mm
Pitch800 µm
Row Spacing4.2926 mm
Terminal Pitch787.4 µm