Driver IC; Device Type:Half-Bridge; Supply Voltage Min:10V; Supply Voltage Max:25V; Package/Case:8-DIP; No. of Pins:8; Operating Temperature Range:-40°C to +125°C; Delay Matching:60ns; Leaded Process Compatible:Yes ;RoHS Compliant: Yes
600 V Half Bridge Driver IC with typical 0.2 A source and 0.35 A sink currents in 8 Lead PDIP package for IGBTs and MOSFETs. Also available in 8 Lead SOIC, 14 Lead SOIC, and 14 Lead PDIP.For the new version with our SOI technology we recommend 2ED2109S06F, providing integrated bootstrap diode, better robustness and higher switching frequency
Type = High Side / Type = Low Side / Outputs = 2 / Configuration = Half Bridge / Rise Time ns = 150 / Fall Time ns = 50 / Output Current mA = 120 / Output Current mA = 250 / Supply Voltage Min. V = 10 / Supply Voltage Max. V = 20 / Operating Temperature Min. °C = -40 / Operating Temperature Max. °C = 125 / Package Type = DIP / Pins = 8 / Mounting Type = Through Hole / Packaging = Tube / Length mm = 10.9 / Width mm = 7.1 / Height mm = 5.33 / Reflow Temperature Max. °C = 300
DRIVER, MOSFET, SINGLE INPUT, 2109; Device Type:MOSFET; Module Configuration:Half Bridge; Peak Output Current:350mA; Input Delay:750ns; Output Delay:200ns; Supply Voltage Range:10V to 20V; Driver Case Style:DIP; No. of Pins:8; Operating Temperature Range:-40°C to +125°C; SVHC:No SVHC (19-Dec-2011); Base Number:2109; IC Generic Number:2109; Logic Function Number:2109; No. of Outputs:2; Offset Voltage:600V; Operating Temperature Max:125°C; Operating Temperature Min:-40°C; Output Current:200mA; Output Current + Max:250mA; Output Sink Current Min:250mA; Output Source Current Min:120mA; Output Voltage:620V; Output Voltage Max:20V; Output Voltage Min:10V; Package / Case:DIP; Power Dissipation Pd:1W; Supply Voltage Max:20V; Supply Voltage Min:10V; Termination Type:Through Hole; Turn Off Time:200ns; Turn On Time:750ns; Voltage Vcc Max:25V; Voltage Vcc Min:10V