供应链
Export Control Classification Number (ECCN) Code3A991.b.2.a
Harmonized Tariff Schedule (HTS) Code8542.32.00.41
Introduction Date2004-10-14
Lifecycle StatusObsolete (Last Updated: 4 months ago)
描述
由其分销商提供的 Infineon CY7C1370D-200BZC 的描述。
SRAM Chip Sync Quad 3.3V 18M-bit 512K x 36 3ns 165-Pin FBGA Tray
Synchronous Obsolete 3-STATE 2011 SRAM Memory 0C~70C TA 3.135V 18Mb 300mA
18-Mbit (512K X 36/1M X 18) Pipelined SRAM with NoBL Architecture
ZBT SRAM, 512KX36, 3ns, CMOS, PBGA165
IC SRAM 18MBIT PARALLEL 165FBGA
制造商别名
Infineon 在全球拥有多个品牌，分销商可将其用作替代名称。Infineon 也可称为以下名称：
- Infineon Technologies
- INF
- INFINEO
- INFINE
- INFIN
- INFINION
- INFI
- INFENION
- SIM
- INFIEON
- INFINEON TECH
- INFINEN
- IFX
- INFIENON
- IR/INFINEON
- INFINEON/IR
- IFT
- INFINEON/SIEMENS
- LNFINEON
- INFN
- Infineon Tech ICs
- INFINEON TECHNOLOGIE
- NFINEON
- INFINEON/Infineon
- INFINEON TECHNOLOGIES (ASIA
技术规格
Physical
Case/PackageFBGA
MountSurface Mount
Number of Pins165
Number of Terminals165
Technical
Access Time3 ns
Address Bus Width19 b
Density18 Mb
Frequency200 MHz
InterfaceParallel
Max Frequency200 MHz
Max Operating Temperature70 °C
Max Supply Current300 mA
Max Supply Voltage3.6 V
Memory Size2.3 MB
Memory TypeRAM, SDR, SRAM
Min Operating Temperature0 °C
Min Supply Voltage3.135 V
Nominal Supply Current300 mA
Number of Circuits1
Number of Ports4
Number of Words512000
Operating Supply Voltage3.3 V
Sync/AsyncSynchronous
Temperature GradeCommercial
Word Size36 b
Dimensions
Height - Seated (Max)1.4 mm
Length15 mm
Terminal Pitch1 mm
Width13 mm
合规
环境分类
China RoHSNon-Compliant
Lead FreeContains Lead
Radiation HardeningNo
REACH SVHCNo
RoHSNon-Compliant
合规声明