供应链
Country of OriginTaiwan
Export Control Classification Number (ECCN) Code5A002.A.4
Harmonized Tariff Schedule (HTS) Code8542.31.00.60
Introduction Date2016-06-03
Lifecycle StatusProduction (Last Updated: 3 months ago)
描述
由其分销商提供的 AMD XCZU9EG-3FFVC900E 的描述。
FPGA Zynq UltraScale+ Family 599550 Cells 20nm Technology 1V 900-Pin FC-BGA Tray
Field Programmable Gate Array, 599550-Cell, PBGA900
Zynq UltraScale+ RFSoC, Speed Grade-3, Logic Cells 600K, C900, RoHS
Xilinx SCT
FPGA SOC, 34260 CLBS, 599550-Cell, PBGA900
制造商别名
AMD 在全球拥有多个品牌，分销商可将其用作替代名称。AMD 也可称为以下名称：
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
技术规格
Physical
Case/PackageBGA
Number of Terminals900
Technical
Max Operating Temperature100 °C
Max Supply Voltage927 mV
Min Operating Temperature0 °C
Min Supply Voltage873 mV
Nominal Supply Voltage (DC)900 mV
Number of Inputs204
Number of Logic Blocks (LABs)34260
Number of Logic Elements/Cells599550
Number of Outputs204
Number of Transceivers24
Speed Grade-3
Dimensions
Height - Seated (Max)3.42 mm
Length31 mm
Terminal Pitch1 mm
Width31 mm