价格与库存
供应链
Harmonized Tariff Schedule (HTS) Code8542.31.00.60
Introduction Date2014-12-16
Lifecycle StatusProduction (Last Updated: 1 month ago)
相关零件
FPGA Virtex UltraScale 2026500 Cells 20nm Technology 0.95V 2104-Pin FCBGA Tray
FPGA Virtex UltraScale 1566600 Cells 20nm Technology 0.95V 2104-Pin FCBGA Tray
FPGA Virtex UltraScale Family 1566600 Cells 20nm Technology 0.95V 2104-Pin FCBGA Tray
XilinxXCVU190-1FLGB2104I
FPGA Virtex UltraScale Family 2349900 Cells 20nm Technology 0.95V 2104-Pin FCBGA Tray
XilinxXCVU125-3FLVC2104E
FPGA Virtex UltraScale Family 1566600 Cells 20nm Technology 1V 2104-Pin FCBGA Tray
描述
由其分销商提供的 AMD XCVU160-2FLGC2104E 的描述。
FPGA Virtex UltraScale 2026500 Cells 20nm Technology 0.95V 2104-Pin FCBGA Tray
Virtex ultrascale FPGA, 120 I/O DLLs, Speed Grade-2, 115.2Mb Total Block RAM, C2104, RoHS
Xilinx SCT
Field Programmable Gate Array, 1560 CLBs, 2.0265e+06-Cell, PBGA2104
IC FPGA VIRTEX-U 2104FCBGA
STN1110-I/MM MICROCHIP
制造商别名
AMD 在全球拥有多个品牌，分销商可将其用作替代名称。AMD 也可称为以下名称：
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
技术规格
Physical
Case/PackageBGA
Contact PlatingCopper, Silver, Tin
MountSurface Mount
Number of Terminals2104
Technical
Max Operating Temperature100 °C
Max Supply Voltage979 mV
Min Operating Temperature0 °C
Min Supply Voltage922 mV
Number of Inputs702
Number of Logic Blocks (LABs)1560
Number of Logic Elements/Cells2.0265e+06
Number of Outputs702
Number of Registers1.8528e+06
Number of Transceivers52
Operating Supply Voltage950 mV
RAM Size14.4 MB
Speed Grade2
Dimensions
Height - Seated (Max)4.32 mm
Length47.5 mm
Terminal Pitch1 mm
Width47.5 mm