供应链
Export Control Classification Number (ECCN) Code3A001.A.7.B
Harmonized Tariff Schedule (HTS) Code8542.31.00.60
Introduction Date2014-12-16
Lifecycle StatusProduction (Last Updated: 2 months ago)
相关零件
Lattice SemiconductorLFSC3GA115E-6FCN1704C
FPGA LatticeSC Family 115000 Cells 90nm Technology 1.2V 1704-Pin CFCBGA
Lattice SemiconductorLFSC3GA80E-7FFN1704C
FPGA LatticeSC Family 80000 Cells 90nm Technology 1.2V 1704-Pin FCBGA
描述
由其分销商提供的 AMD XCVU095-2FFVC2104E 的描述。
FPGA Virtex UltraScale Family 1176000 Cells 20nm Technology 0.95V 2104-Pin FCBGA Tray
Virtex ultrascale FPGA, 64 I/O DLLs, Speed Grade-2, 60.8Mb Total Block RAM, C2104, RoHS
Xilinx SCT
Fpga, Virtex Ultrascale, Fcbga-2104; No. Of Logic Blocks:537600; No. Of Macrocells:1176000; Fpga Family:Virtex Ultrascale Series; Logic Case Style:Fcbga; No. Of Pins:2104Pins; No. Of Speed Grades:2; Total Ram Bits:62259Kbit; No. Of Rohs Compliant: Yes |Amd Xilinx XCVU095-2FFVC2104E
制造商别名
AMD 在全球拥有多个品牌，分销商可将其用作替代名称。AMD 也可称为以下名称：
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
技术规格
Physical
Case/PackageBGA
Contact PlatingCopper, Silver, Tin
MountSurface Mount
Number of Pins2104
Number of Terminals2104
Technical
Max Operating Temperature100 °C
Max Supply Voltage979 mV
Min Operating Temperature0 °C
Min Supply Voltage922 mV
Nominal Supply Voltage (DC)950 mV
Number of Inputs832
Number of Logic Blocks (LABs)768
Number of Logic Elements/Cells1.176e+06
Number of Outputs832
Number of Registers1.0752e+06
Number of Transceivers32
Operating Supply Voltage950 mV
Speed Grade2
Dimensions
Height - Seated (Max)4.04 mm
Length47.5 mm
Terminal Pitch1 mm
Width47.5 mm