供应链
Country of OriginTaiwan
Export Control Classification Number (ECCN) Code3A991.D
Harmonized Tariff Schedule (HTS) Code8542.39.00.01
Introduction Date2016-06-03
Lifecycle StatusProduction (Last Updated: 2 months ago)
描述
由其分销商提供的 AMD XCKU3P-L1FFVB676I 的描述。
FPGA, Kintex UltraScale+ Series, SRAM, 355950 Logic Cells, 280 I/Os, 676 Pins, FCBGA
Kintex UltraScale FPGA, Speed Grade-L1, Logic Cells 356K, B676, RoHS
Xilinx SCT
Field Programmable Gate Array, 20340 CLBS, 355950-Cell, PBGA676
IC MCU 32BIT 2MB FLASH 100LQFP
ROHS3Compliant Active 8542.39.00.01 FIELD PROGRAMMABLE GATE ARRAY field programmable gate array -40C~100C TJ 0.698V~0.876V
制造商别名
AMD 在全球拥有多个品牌，分销商可将其用作替代名称。AMD 也可称为以下名称：
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
技术规格
Physical
Case/PackageBGA
Number of Terminals676
Technical
Max Operating Temperature100 °C
Max Supply Voltage742 mV
Min Operating Temperature-40 °C
Min Supply Voltage698 mV
Nominal Supply Voltage (DC)720 mV
Number of Inputs304
Number of Logic Blocks (LABs)20340
Number of Logic Elements/Cells355950
Number of Outputs304
Number of Transceivers0
RAM Size1.7 MB
Speed Grade-L1
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)3.52 mm
Length27 mm
Terminal Pitch1 mm
Width27 mm