描述
由其分销商提供的 AMD XCKU3P-3FFVB676E 的描述。
FPGA Kintex UltraScale+ Family 355950 Cells 20nm 0.9V 676-Pin FCBGA Tray
Kintex UltraScale FPGA, Speed Grade-3, Logic Cells 356K, B676, RoHS
Xilinx SCT
2012 ROHS3Compliant Active 8542.39.00.01 field programmable gate array 0C~100C TJ 0.873V~0.927V
IC FPGA 280 I/O 676FCBGA / Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 280 31641600 355950 676-BBGA, FCBGA
3.7719727MB 355950 20340 873mV 927mV FBGA-676
制造商别名
AMD 在全球拥有多个品牌，分销商可将其用作替代名称。AMD 也可称为以下名称：
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
技术规格
Physical
Case/PackageBGA
Number of Terminals676
Technical
Max Operating Temperature100 °C
Max Supply Voltage927 mV
Min Operating Temperature0 °C
Min Supply Voltage873 mV
Nominal Supply Voltage (DC)900 mV
Number of Inputs304
Number of Logic Blocks (LABs)20340
Number of Logic Elements/Cells355950
Number of Outputs304
Number of Transceivers0
RAM Size1.7 MB
Speed Grade-3
Dimensions
Height - Seated (Max)3.52 mm
Length27 mm
Terminal Pitch1 mm
Width27 mm