供应链
Country of OriginTaiwan
Export Control Classification Number (ECCN) Code3A001.A.7.B
Harmonized Tariff Schedule (HTS) Code8542.31.00.60
Introduction Date2014-12-16
Lifecycle StatusProduction (Last Updated: 1 month ago)
相关零件
FPGA Kintex UltraScale 1176000 Cells 20nm Technology 0.95V 1517-Pin FCBGA Tray
FPGA Kintex UltraScale 1176000 Cells 20nm Technology 0.95V 1517-Pin FCBGA Tray
FPGA Kintex UltraScale 1176000 Cells 20nm Technology 0.95V 1760-Pin FCBGA Tray
描述
由其分销商提供的 AMD XCKU095-2FFVB2104E 的描述。
FPGA Kintex UltraScale 1176000 Cells 20nm Technology 0.95V 2104-Pin FCBGA Tray
Field Programmable Gate Array, 67200 CLBS, 1176000-Cell, PBGA2104
4.2-V TO 60-V INPUT, 1-V TO 6-V
Fpga, Kintex Ultrascale, Fcbga-2104; No. Of Logic Blocks:537600; No. Of Macrocells:1176000; Fpga Family:Kintex Ultrascale Series; Logic Case Style:Fcbga; No. Of Pins:2104Pins; No. Of Speed Grades:2; Total Ram Bits:60518Kbit; No. Of Rohs Compliant: Yes |Amd Xilinx XCKU095-2FFVB2104E
制造商别名
AMD 在全球拥有多个品牌，分销商可将其用作替代名称。AMD 也可称为以下名称：
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
技术规格
Physical
Case/PackageBGA
Contact PlatingCopper, Silver, Tin
MountSurface Mount
Number of Terminals2104
Technical
Max Operating Temperature100 °C
Max Supply Voltage979 mV
Min Operating Temperature0 °C
Min Supply Voltage922 mV
Number of Inputs702
Number of Logic Blocks (LABs)67200
Number of Logic Elements/Cells1.176e+06
Number of Outputs702
Number of Registers1.0752e+06
Operating Supply Voltage950 mV
Speed Grade2
Dimensions
Height - Seated (Max)3.86 mm
Length47.5 mm
Terminal Pitch1 mm
Width47.5 mm