相关零件
FPGA Kintex UltraScale 1088325 Cells 20nm Technology 0.95V 1517-Pin FCBGA Tray
FPGA Kintex UltraScale 1088325 Cells 20nm Technology 0.95V 1517-Pin FCBGA Tray
FPGA Kintex UltraScale 1088325 Cells 20nm Technology 0.95V 1760-Pin FCBGA Tray
描述
由其分销商提供的 AMD XCKU085-2FLVB1760E 的描述。
FPGA Kintex UltraScale 1088325 Cells 20nm Technology 0.95V 1760-Pin FCBGA Tray
IC FPGA 676 I/O 1760FCBGA / Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 676 58265600 1088325 1760-BBGA, FCBGA
Fpga, Kintex Ultrascale, Fcbga-1760; No. Of Logic Blocks:497520; No. Of Macrocells:1088325; Fpga Family:Kintex Ultrascale Series; Logic Case Style:Fcbga; No. Of Pins:1760Pins; No. Of Speed Grades:2; Total Ram Bits:58266Kbit; No. Of Rohs Compliant: Yes |Amd Xilinx XCKU085-2FLVB1760E
制造商别名
AMD 在全球拥有多个品牌，分销商可将其用作替代名称。AMD 也可称为以下名称：
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
技术规格
Physical
Case/PackageBGA
Contact PlatingCopper, Silver, Tin
MountSurface Mount
Number of Terminals1760
Technical
Max Operating Temperature100 °C
Max Supply Voltage979 mV
Min Operating Temperature0 °C
Min Supply Voltage922 mV
Number of Inputs676
Number of Logic Blocks (LABs)62190
Number of Logic Elements/Cells1.088325e+06
Number of Outputs676
Number of Registers995040
Operating Supply Voltage950 mV
Speed Grade2
Dimensions
Height - Seated (Max)4.11 mm
Length42.5 mm
Terminal Pitch1 mm
Width42.5 mm