描述
由其分销商提供的 AMD XC7Z035-3FBG676E 的描述。
FPGA Zynq-7000 275000 Cells 28nm Technology 1V 676-Pin FCBGA Tray
FPGA SOC, 21487 CLBS, 275000-Cell, PBGA676
IC SOC CORTEX-A9 800MHZ 676FCBGA
PSOC, ARM CORTEX-A9, 1GHZ, FCBGA-676
IC REG MULT CONFG ADJ 500MA 8DIP
IC SOC CORTEX-A9 KINTEX7 676BGA
Psoc, Arm Cortex-A9, 1Ghz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:1Ghz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotive Rohs Compliant: Yes |Amd Xilinx XC7Z035-3FBG676E
制造商别名
AMD 在全球拥有多个品牌，分销商可将其用作替代名称。AMD 也可称为以下名称：
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
技术规格
Physical
Case/PackageBGA
Contact PlatingCopper, Silver, Tin
MountSurface Mount
Number of Terminals676
Technical
Core ArchitectureARM
Frequency800 MHz
InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Operating Temperature100 °C
Max Supply Voltage1.05 V
Min Operating Temperature0 °C
Min Supply Voltage950 mV
Number of I/Os130
Number of Inputs378
Number of Logic Blocks (LABs)21487
Number of Logic Elements/Cells275000
Number of Outputs378
Number of Registers343800
Operating Supply Voltage1 V
PeripheralsDMA
Propagation Delay110 ps
RAM Size2 MB
Speed Grade3
Dimensions
Height - Seated (Max)2.54 mm
Length27 mm
Terminal Pitch1 mm
Width27 mm