供应链
Country of OriginTaiwan
Harmonized Tariff Schedule (HTS) Code8542.31.00.60
Introduction Date2014-10-08
Lifecycle StatusProduction (Last Updated: 1 month ago)
描述
由其分销商提供的 AMD XC7Z035-2FFG900E 的描述。
FPGA Zynq-7000 275000 Cells 28nm Technology 1V 900-Pin FC-BGA
PSOC, ARM CORTEX-A9, 800MHZ, FCBGA-900
IC SOC CORTEX-A9 800MHZ 900FCBGA
IC SOC CORTEX-A9 KINTEX7 900BGA
CAP ALUM POLY 56UF 20% 25V SMD
IC SOC CORTEX-A9 800MHZ 900FCBGA / Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC series Kintex™-7 FPGA, 275K Logic Cells 800MHz 900-FCBGA (31x31)
Psoc, Arm Cortex-A9, 800Mhz, Fcbga-900; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:800Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z035-2FFG900E
制造商别名
AMD 在全球拥有多个品牌，分销商可将其用作替代名称。AMD 也可称为以下名称：
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
技术规格
Physical
Case/PackageBGA
Contact PlatingCopper, Silver, Tin
MountSurface Mount
Number of Terminals900
Technical
Core ArchitectureARM
Frequency800 MHz
InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Operating Temperature100 °C
Max Supply Voltage1.05 V
Min Operating Temperature0 °C
Min Supply Voltage950 mV
Number of I/Os130
Number of Registers343800
Operating Supply Voltage1 V
PeripheralsDMA
Propagation Delay100 ps
RAM Size250 kB
Speed Grade2
Dimensions
Height - Seated (Max)3.35 mm
Length31 mm
Terminal Pitch1 mm
Width31 mm