描述
由其分销商提供的 AMD XC7K325T-3FFG676E 的描述。
FPGA Kintex-7 Family 326080 Cells 28nm Technology 1V 676-Pin BGA
Field Programmable Gate Array, 25475 CLBs, 1412MHz, 326080-Cell, CMOS, PBGA676
Kintex-7 FPGA, 150 HP User I/O, 250 HR User I/O, 16 GTX, 676-Ball BGA, Speed Grade 3, Extended Grade, FFG676, RoHS
Xilinx SCT
FPGA, KINTEX-7 , 250 I/O, FCBGA-676
Fpga, Kintex-7 , 250 I/O, Fcbga-676; No. Of Logic Blocks:50950; No. Of Macrocells:326080; Fpga Family:Kintex-7; Logic Case Style:Fcbga; No. Of Pins:676Pins; No. Of Speed Grades:3; Total Ram Bits:16020Kbit; No. Of I/O S:250I/O S; Rohs Compliant: Yes |Amd Xilinx XC7K325T-3FFG676E
制造商别名
AMD 在全球拥有多个品牌，分销商可将其用作替代名称。AMD 也可称为以下名称：
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
技术规格
Physical
Case/PackageBGA
Number of Terminals676
Technical
Max Frequency1.412 GHz
Max Operating Temperature100 °C
Max Supply Voltage1.03 V
Memory Size1 GB
Memory TypeDDR3
Min Operating Temperature0 °C
Min Supply Voltage970 mV
Number of ADC Channels1
Number of I/Os500
Number of Inputs400
Number of Logic Blocks (LABs)25475
Number of Logic Elements/Cells326080
Number of Outputs400
Number of Registers407600
Number of Transceivers16
Operating Supply Voltage1 V
RAM Size2 MB
Speed Grade-3
Dimensions
Height - Seated (Max)3.37 mm
Length27 mm
Terminal Pitch1 mm
Width27 mm