供应链
Country of OriginTaiwan
Export Control Classification Number (ECCN) Code3A991.D
Harmonized Tariff Schedule (HTS) Code8542.39.00.01
Introduction Date2013-01-17
Lifecycle StatusProduction (Last Updated: 1 month ago)
描述
由其分销商提供的 AMD XC7A200T-L2FBG676E 的描述。
FPGA Artix-7 Family 215360 Cells 28nm Technology 1V 676-Pin FCBGA
Field Programmable Gate Array, 16825 CLBs, 1286MHz, 215360-Cell, CMOS, PBGA676
IC FPGA 400 I/O 676FCBGA / series Field Programmable Gate Array (FPGA) IC 400 13455360 215360 676-BBGA, FCBGA
FPGA, ARTIX-7, 400 I/O, FCBGA-676
IC FPGA ARTIX7 400 I/O 676FCBGA
1.6040039MB 215360 16825 950mV 1.05V FCBGA
Programmable Logic Device (CPLD/FPGA)
IC MCU 32B 1.03125MB FLSH 80LQFP
Fpga, Artix-7, 400 I/O, Fcbga-676; No. Of Logic Blocks:33650; No. Of Macrocells:215360; Fpga Family:Artix-7; Logic Case Style:Fcbga; No. Of Pins:676Pins; No. Of Speed Grades:-; Total Ram Bits:13140Kbit; No. Of I/O S:400I/O S; Clock Rohs Compliant: Yes |Amd Xilinx XC7A200T-L2FBG676E
制造商别名
AMD 在全球拥有多个品牌，分销商可将其用作替代名称。AMD 也可称为以下名称：
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
技术规格
Physical
Case/PackageBGA
MountSurface Mount
Number of Terminals676
Technical
Max Frequency1.286 GHz
Max Operating Temperature100 °C
Max Supply Voltage930 mV
Min Operating Temperature0 °C
Min Supply Voltage870 mV
Number of I/Os400
Number of Inputs400
Number of Logic Blocks (LABs)16825
Number of Logic Elements/Cells215360
Number of Outputs400
Number of Registers269200
Operating Supply Voltage900 mV
Propagation Delay110 ps
RAM Size1.6 MB
Dimensions
Height - Seated (Max)2.54 mm
Length27 mm
Terminal Pitch1 mm
Width27 mm