供应链
Export Control Classification Number (ECCN) Code3A991.D
Harmonized Tariff Schedule (HTS) Code8542.31.00.30
Introduction Date2014-06-04
Lifecycle StatusProduction (Last Updated: 2 months ago)
相关零件
MicrochipA2F200M3F-1FGG484
FPGA SmartFusion 200K Gates 2000 Cells 100MHz 130nm (CMOS) Technology 1.5V 484-Pin FBGA
MicrochipA2F200M3F-FG484I
FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 484-Pin FBGA
描述
由其分销商提供的 AMD XA7Z020-1CLG484Q 的描述。
256KB ARM-ASeries 667MHz CSPBGA-484 Microcontroller Units (MCUs/MPUs/SOCs) ROHS
MPU Zynq-7000 RISC 32-Bit 667MHz 1.8V/3.3V 484-Pin CSBGA
Flash PLD, 10ns, 144-Cell, CMOS, PQFP144
IC SOC CORTEX-A9 667MHZ 484BGA
制造商别名
AMD 在全球拥有多个品牌，分销商可将其用作替代名称。AMD 也可称为以下名称：
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
技术规格
Physical
Case/PackageLFBGA
Contact PlatingCopper, Silver, Tin
MountSurface Mount
Number of Pins484
Number of Terminals484
Technical
Core ArchitectureARM
Data Bus Width32 b
Frequency667 MHz
InterfaceCAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Frequency667 MHz
Max Operating Temperature125 °C
Min Operating Temperature-40 °C
Number of I/Os130
Operating Supply Voltage1 V
PeripheralsDMA
RAM Size256 kB
Temperature GradeAutomotive
Dimensions
Height - Seated (Max)1.6 mm
Length19 mm
Terminal Pitch800 µm
Width19 mm