供应链
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.71
Introduction Date1989-01-01
Lifecycle StatusObsolete (Last Updated: 1 year ago)
描述
由其分销商提供的 AMD AM27S27/BWA 的描述。
512X8 OTPROM, CDIP22, 0.400 INCH, CERAMIC, DIP-22
OTP ROM, 512X8, Bipolar, CDIP22
IC PROM 4KBIT PARALLEL 22CDIP
AM27S27 - OTP ROM, 512X8, 30NS
制造商别名
AMD 在全球拥有多个品牌，分销商可将其用作替代名称。AMD 也可称为以下名称：
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
技术规格
Physical
Body MaterialCeramic
Case/PackageDIP
Number of Terminals22
Technical
Access Time30 ns
InterfaceParallel
Max Operating Temperature125 °C
Max Supply Current185 mA
Max Supply Voltage5.25 V
Min Operating Temperature-55 °C
Min Supply Voltage4.5 V
Number of Circuits1
Operating Supply Voltage5 V
Temperature GradeMilitary
Dimensions
Height - Seated (Max)5.588 mm
Length27.4955 mm
Terminal Pitch2.54 mm
Width10.16 mm