由其分销商提供的 Advanced Thermal Solutions ATS-PCB1003 的描述。
Heat Sinks BGA Heat Sink, Board Level Stamp, No TIM, Black, TO220, 38.1x12.7x12.7mm (LxWxH)
38.1 x 12.7 x 12.7 mm Board Level Stamped Heat Sink
Heat Sink, 3Deg C/W, 1.5"x0.5"x0.5"; Thermal Resistance:3°C/W; Packages Cooled:To-220; External Width - Metric:12.7Mm; External Height - Metric:12.7Mm; External Length - Metric:38.1Mm; External Diameter - Metric:-; Product Range:- Rohs Compliant: Yes |Advanced Thermal Solutions ATS-PCB1003