ATS-51300R-C2-R0 by Advanced Thermal Solutions

Advanced Thermal Solutions ATS-51300R-C2-R0

Heat Sink 30MM X 30MM X 19.5MM

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数据表和文档

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element14 APAC

Datasheet1 页18 年前

描述

由其分销商提供的 Advanced Thermal Solutions ATS-51300R-C2-R0 的描述。

HEAT SINK 30MM X 30MM X 19.5MM

DigiKey

HEAT SINK, MAXIGRIP; Thermal Resistance: 2.6°C/W; Packages Cooled: BGA; External Width - Metric: 30mm; External Height - Metric: 19.5mm; External Length - Metric: 53.34mm; External Diameter - Metric: -; Heat Sink Material: Alum

Farnell

HEAT SINK, MAXIGRIP; IC - Transistor Case:BGA; Thermal Resistance:2.6°C/W; External Width:30mm; Height:19.5mm; Heatsink Material:Aluminium; External Height:19.5mm; Length:53.34mm; Mounting Type:Clip-on; Package / Case:BGA ;RoHS Compliant: Yes

Newark