NXP Semiconductors SGTL5000XNLA3R2

Audio Codec , Ultra Low-Power, 4 mw for DAC-to-HP, 98 dB SNR and -80 dB THD+N, QFN 32, Reel

Price and Stock

Authorized Distributors
Non-Authorized Stocking Distributors
Non-Authorized Dealers

Technical Specifications

Physical
Case/PackageQFN EP
Contact PlatingTin
Number of Pins20
Weight15.790684 mg
Technical
Ambient Temperature Range High85 °C
InterfaceI2C, I2S, SPI
Max Operating Temperature85 °C
Max Supply Voltage3.6 V
Min Operating Temperature-40 °C
Min Supply Voltage1.1 V
Number of A/D Converters1
Number of ADC Channels1
Number of Analog Inputs3
Number of Analog Outputs4
Number of Channels2
Number of D/A Converters1
Number of DAC Channels1
PackagingTape and Reel
Resolution3 B
Sampling Rate96 ksps
Schedule B8542390000
Signal to Noise Ratio (SNR)85 dB
TypeGeneral Purpose
Dimensions
Height600 µm

Documents

Download datasheets and manufacturer documentation for NXP Semiconductors SGTL5000XNLA3R2.

NXP Semiconductors
Datasheet68 pages17 years ago
Freescale Semiconductor
Datasheet73 pages17 years ago
Technical Drawing3 pages10 years ago
Upverter
Technical Drawing3 pages8 years ago

Inventory History

3 month trend:
-3.19%

Engineering Resources

View Evaluation kits and Reference designs for NXP Semiconductors SGTL5000XNLA3R2.

Descriptions

Descriptions of NXP Semiconductors SGTL5000XNLA3R2 provided by its distributors.

Audio Codec , Ultra Low-Power, 4 mw for DAC-to-HP, 98 dB SNR and -80 dB THD+N, QFN 32, Reel
SGTL5000 Series 3.6 V Low Power Stereo Codec with Headphone Amp - QFN-20
General Purpose Audio Codec 1ADC / 1DAC Ch Medical 20-Pin QFN EP T/R
AUDIO CODEC, STEREO, 48KSPS, QFN-20; Audio CODEC Type: Stereo; No. of ADCs: 1; No. of DACs: 1; Operating Temperature Min: -40°C; Operating Temperature Max: 85°C; Sampling Rate: 48kSPS; Audio IC Case Style: QFN; No. of Pins: 20Pi

Manufacturer Aliases

NXP Semiconductors has several brands around the world that distributors may use as alternate names. NXP Semiconductors may also be known as the following names:

  • NXP
  • PHILIPS
  • PHIL
  • PHI
  • PHILLIPS
  • NXP USA Inc
  • NXP SEMI
  • NXP SEMICONDUCTOR
  • PHILIPS/NXP
  • PHILIPS SEMICONDUCTORS
  • PHILIP
  • Philips Semiconductor
  • NXP/PHILIPS
  • PHILPS
  • PHILIPS COMPONENTS
  • PHILIPS SEMI
  • PHL
  • PHLIPS
  • NXP Semicon
  • PHILIPS ECG
  • NXP / Freescale
  • PHILL
  • Philips Semiconducto
  • PHILLIP
  • PHILI
  • Philips Semiconductors
  • NXP Semiconductors NV
  • NXP

Part Number Aliases

This part may be known by these alternate part numbers:

  • SGTL5000XNLA3/R2
  • SGTL5000XNLA3R2.

Technical Specifications

Physical
Case/PackageQFN EP
Contact PlatingTin
Number of Pins20
Weight15.790684 mg
Technical
Ambient Temperature Range High85 °C
InterfaceI2C, I2S, SPI
Max Operating Temperature85 °C
Max Supply Voltage3.6 V
Min Operating Temperature-40 °C
Min Supply Voltage1.1 V
Number of A/D Converters1
Number of ADC Channels1
Number of Analog Inputs3
Number of Analog Outputs4
Number of Channels2
Number of D/A Converters1
Number of DAC Channels1
PackagingTape and Reel
Resolution3 B
Sampling Rate96 ksps
Schedule B8542390000
Signal to Noise Ratio (SNR)85 dB
TypeGeneral Purpose
Dimensions
Height600 µm

Documents

Download datasheets and manufacturer documentation for NXP Semiconductors SGTL5000XNLA3R2.

NXP Semiconductors
Datasheet68 pages17 years ago
Freescale Semiconductor
Datasheet73 pages17 years ago
Technical Drawing3 pages10 years ago
Upverter
Technical Drawing3 pages8 years ago

Compliance

Environmental Classification
Halogen FreeNot Halogen Free
Lead FreeLead Free
Radiation HardeningNo
RoHSCompliant
Compliance Statements
Materials Sheet5 pages12 years ago
Rohs Statement1 page11 years ago
Reach Statement3 pages11 years ago
Conflict Mineral Statement1 page10 years ago
Rohs Statement1 page12 years ago
Reach Statement2 pages8 years ago