Winbond W979H2KBQX2I
Production
Supply Chain
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.28
Introduction Date2014-08-25
Lifecycle StatusProduction (Last Updated: 4 months ago)
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DRAM Chip LPDDR2 SDRAM 512M-Bit 16Mx32 1.2V/1.8V 168-Pin WFBGA T/R
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DRAM Chip LPDDR2 SDRAM 512M-Bit 16Mx32 1.2V/1.8V 134-Pin VF-BGA T/R
Descriptions
Descriptions of Winbond W979H2KBQX2I provided by its distributors.
DRAM Chip Mobile LPDDR2 SDRAM 512Mbit 16Mx32 1.2V/1.8V 168-Pin WFBGA
BALL Parallel BOTTOM RAM SDRAM ic memory 85C 1.14V 536870912bit 12mm
LPDDR2 DRAM, 16MX32, CMOS, PBGA168
IC SDRAM 512MBIT 400MHZ 168WFBGA
DRAM 512Mb LPDDR2, x32, 400MHz, -40 ~ 85C
IC DRAM 512M PARALLEL 168WFBGA
Manufacturer Aliases
Winbond has several brands around the world that distributors may use as alternate names. Winbond may also be known as the following names:
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
Technical Specifications
Physical
Number of Pins168
Number of Terminals168
Technical
Frequency400 MHz
InterfaceParallel
Max Operating Temperature85 °C
Max Supply Voltage1.3 V
Memory TypeRAM, SDRAM
Min Operating Temperature-40 °C
Min Supply Voltage1.14 V
Number of Circuits1
Number of Ports1
Operating Supply Voltage1.2 V
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)800 µm
Length12 mm
Terminal Pitch500 µm
Width12 mm