NXP Semiconductors MRFE6VP6300HR5

RF Power Transistor, 1.8 to 600 MHz, 300 W, Typ Gain in dB is 25 @ 130 MHz, 50 V, LDMOS, SOT1827

Price and Stock

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Non-Authorized Dealers

Technical Specifications

Physical
Contact PlatingGold
MountScrew, Surface Mount
Number of Pins780
Weight6.395794 g
Technical
Continuous Drain Current (ID)100 mA
Drain to Source Breakdown Voltage130 V
Drain to Source Voltage (Vdss)130 V
Frequency230 MHz
Gain26.5 dB
Gate to Source Voltage (Vgs)10 V
Max Frequency600 MHz
Max Junction Temperature (Tj)225 °C
Max Operating Temperature225 °C
Max Power Dissipation1.05 kW
Min Breakdown Voltage125 V
Min Operating Temperature-65 °C
Number of Channels1
Number of Elements2
Output Power300 W
Power Dissipation1.05 kW
Schedule B8541290080
Test Current100 mA
Test Voltage50 V
Voltage Rating130 V
Dimensions
Height4.32 mm

Documents

Download datasheets and manufacturer documentation for NXP Semiconductors MRFE6VP6300HR5.

Future Electronics
Datasheet15 pages12 years ago
Freescale Semiconductor
Datasheet15 pages12 years ago
Technical Drawing2 pages10 years ago
Upverter
Technical Drawing19 pages13 years ago

Inventory History

3 month trend:
+219%

Engineering Resources

View Evaluation kits and Reference designs for NXP Semiconductors MRFE6VP6300HR5.

Related Parts

Descriptions

Descriptions of NXP Semiconductors MRFE6VP6300HR5 provided by its distributors.

RF Power Transistor,1.8 to 600 MHz, 300 W, Typ Gain in dB is 25 @ 130 MHz, 50 V, LDMOS, SOT1827
Lateral N-Channel Broadband RF Power MOSFET, 1.8-600 MHz, 300 W, 50 V, CFM4F, RoHS
NXP Semiconductors SCT
RF POWER FET, N CH, 125V, NI-780-4; Transistor Type:RF MOSFET; Drain Source Voltage Vds:125V; Continuous Drain Current Id:100mA; Power Dissipation Pd:300W; Operating Frequency Min:1.8MHz; Operating Frequency Max:600MHz; No. of Pins:4;RoHS Compliant: Yes

Manufacturer Aliases

NXP Semiconductors has several brands around the world that distributors may use as alternate names. NXP Semiconductors may also be known as the following names:

  • NXP
  • PHILIPS
  • PHIL
  • PHI
  • PHILLIPS
  • NXP USA Inc
  • NXP SEMI
  • NXP SEMICONDUCTOR
  • PHILIPS/NXP
  • PHILIPS SEMICONDUCTORS
  • PHILIP
  • Philips Semiconductor
  • NXP/PHILIPS
  • PHILPS
  • PHILIPS COMPONENTS
  • PHILIPS SEMI
  • PHL
  • PHLIPS
  • NXP Semicon
  • PHILIPS ECG
  • NXP / Freescale
  • PHILL
  • Philips Semiconducto
  • PHILLIP
  • PHILI
  • Philips Semiconductors
  • NXP Semiconductors NV
  • NXP

Technical Specifications

Physical
Contact PlatingGold
MountScrew, Surface Mount
Number of Pins780
Weight6.395794 g
Technical
Continuous Drain Current (ID)100 mA
Drain to Source Breakdown Voltage130 V
Drain to Source Voltage (Vdss)130 V
Frequency230 MHz
Gain26.5 dB
Gate to Source Voltage (Vgs)10 V
Max Frequency600 MHz
Max Junction Temperature (Tj)225 °C
Max Operating Temperature225 °C
Max Power Dissipation1.05 kW
Min Breakdown Voltage125 V
Min Operating Temperature-65 °C
Number of Channels1
Number of Elements2
Output Power300 W
Power Dissipation1.05 kW
Schedule B8541290080
Test Current100 mA
Test Voltage50 V
Voltage Rating130 V
Dimensions
Height4.32 mm

Documents

Download datasheets and manufacturer documentation for NXP Semiconductors MRFE6VP6300HR5.

Future Electronics
Datasheet15 pages12 years ago
Freescale Semiconductor
Datasheet15 pages12 years ago
Technical Drawing2 pages10 years ago
Upverter
Technical Drawing19 pages13 years ago

Compliance

Environmental Classification
Radiation HardeningNo
RoHSCompliant
Compliance Statements
Materials Sheet5 pages9 years ago
Rohs Statement1 page11 years ago
Reach Statement3 pages11 years ago
Conflict Mineral Statement1 page10 years ago
Rohs Statement1 page12 years ago
Reach Statement2 pages8 years ago