NXP Semiconductors MKL04Z32VLC4

Kinetis KL04: 48MHz Cortex-M0+ Ultra-Low Power MCU, 32KB Flash, 4KB SRAM, 32-LQFP

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Technical Specifications

Physical
Case/PackageLQFP
MountSurface Mount
Number of Pins32
Weight188.609377 mg
Technical
Ambient Temperature Range High105 °C
Core ArchitectureARM
Data Bus Width32 b
Frequency48 MHz
InterfaceI2C, SPI, UART
Max Frequency48 MHz
Max Junction Temperature (Tj)125 °C
Max Operating Temperature105 °C
Max Supply Voltage3.6 V
Memory Size32 kB
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage1.7 V
Number of A/D Converters1
Number of ADC Channels1
Number of I2C Channels1
Number of I/Os28
Number of SPI Channels1
Number of Timers/Counters4
Number of UART Channels1
Oscillator TypeInternal
PeripheralsBrown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
RAM Size4 kB
Schedule B8542310000
Dimensions
Height1.6 mm

Documents

Download datasheets and manufacturer documentation for NXP Semiconductors MKL04Z32VLC4.

Augswan
Datasheet49 pages9 years ago
Upverter
Technical Drawing6 pages7 years ago
Freescale Semiconductor
Technical Drawing3 pages10 years ago
Datasheet46 pages11 years ago

Inventory History

3 month trend:
+0.87%

Engineering Resources

View Evaluation kits and Reference designs for NXP Semiconductors MKL04Z32VLC4.

Related Parts

Descriptions

Descriptions of NXP Semiconductors MKL04Z32VLC4 provided by its distributors.

Kinetis KL04: 48MHz Cortex-M0+ Ultra-Low Power MCU, 32KB Flash, 4KB SRAM, 32-LQFP
MCU 32-bit Kinetis KL04 ARM Cortex M0+ RISC 32KB Flash 1.8V/2.5V/3.3V 32-Pin LQFP Tray
MCU, 32BIT, CORTEX-M0+, 48MHZ, LQFP-32; Product Range: Kinetis L Family KL0x Series Microcontrollers; Architecture: ARM Cortex-M0+; No. of Bits: 32bit; CPU Speed: 48MHz; Program Memory Size: 32KB; RAM Memory Size: 4KB; No. of Pins: 32Pins; MCU Case Style: LQFP; No. of I/O's: 28I/O's; Embedded Interface Type: I2C, SPI, UART; Supply Voltage Min: 1.71V; Supply Voltage Max: 3.6V; MCU Family: Kinetis L; MCU Series: KL0x; MSL: MSL 3 - 168 hours; SVHC: No SVHC (15-Jan-2019)

Manufacturer Aliases

NXP Semiconductors has several brands around the world that distributors may use as alternate names. NXP Semiconductors may also be known as the following names:

  • NXP
  • PHILIPS
  • PHIL
  • PHI
  • PHILLIPS
  • NXP USA Inc
  • NXP SEMI
  • NXP SEMICONDUCTOR
  • PHILIPS/NXP
  • PHILIPS SEMICONDUCTORS
  • PHILIP
  • Philips Semiconductor
  • NXP/PHILIPS
  • PHILPS
  • PHILIPS COMPONENTS
  • PHILIPS SEMI
  • PHL
  • PHLIPS
  • NXP Semicon
  • PHILIPS ECG
  • NXP / Freescale
  • PHILL
  • Philips Semiconducto
  • PHILLIP
  • PHILI
  • Philips Semiconductors
  • NXP Semiconductors NV
  • NXP

Technical Specifications

Physical
Case/PackageLQFP
MountSurface Mount
Number of Pins32
Weight188.609377 mg
Technical
Ambient Temperature Range High105 °C
Core ArchitectureARM
Data Bus Width32 b
Frequency48 MHz
InterfaceI2C, SPI, UART
Max Frequency48 MHz
Max Junction Temperature (Tj)125 °C
Max Operating Temperature105 °C
Max Supply Voltage3.6 V
Memory Size32 kB
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage1.7 V
Number of A/D Converters1
Number of ADC Channels1
Number of I2C Channels1
Number of I/Os28
Number of SPI Channels1
Number of Timers/Counters4
Number of UART Channels1
Oscillator TypeInternal
PeripheralsBrown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
RAM Size4 kB
Schedule B8542310000
Dimensions
Height1.6 mm

Documents

Download datasheets and manufacturer documentation for NXP Semiconductors MKL04Z32VLC4.

Augswan
Datasheet49 pages9 years ago
Upverter
Technical Drawing6 pages7 years ago
Freescale Semiconductor
Technical Drawing3 pages10 years ago
Datasheet46 pages11 years ago

Compliance

Environmental Classification
REACH SVHCNo SVHC
RoHSCompliant
Compliance Statements
Materials Sheet5 pages9 years ago
Rohs Statement1 page11 years ago
Reach Statement3 pages11 years ago
Conflict Mineral Statement1 page10 years ago
Rohs Statement1 page12 years ago
Reach Statement2 pages8 years ago